Wire/Die Bonding AOI

Solid state wire bonding AOI inspection machine, also known as wire bonding AOI inspection machine, is mainly used for efficient AOI inspection of defects after die bonding and wire bonding in the semiconductor packaging and testing field. It has the characteristics of high speed, high precision, and high inspection coverage. Optical system modules and core detection algorithms with completely independent intellectual property rights, as well as AI deep learning algorithms, are suitable for detecting various defects on grain surfaces, solder joints, solder wires, and frame surfaces that occur during the solidification and wire bonding processes.